Characterization, design, modeling, and model validation of silicon on-wafer M:N balun components under match and un-matched conditions

In this paper, we characterize and model M:N baluns for RFIC design. A modeling methodology is presented, based on a scalable lumped-element approach that incorporates both skin effect and substrate loss. The impedance transformation characteristics of the scalable model are explored. The modeling approach is validated with measured S-parameters and extracted impedances from various circuit configurations. Matching considerations are addressed by evaluating the model accuracy with measured data under matched and un-matched conditions.