DocumentCode
158801
Title
Computational fluid dynamics analysis of diffuse vacuum arcs
Author
Vaze, Mahesh ; Acharya, Viren ; Hemachander, M. ; Kulkarni, Santosh
Author_Institution
Global R & D centre, Crompton Greaves Ltd., Mumbai, India
fYear
2014
fDate
Sept. 28 2014-Oct. 3 2014
Firstpage
309
Lastpage
312
Abstract
A two-dimensional axi-symmetric numerical model is developed in order to understand the characteristics of diffused vacuum arc. Vacuum arcs mainly consist of metal vapors which are generated by local evaporation of the contact material due to higher current densities. Strong coupling and high gradients between many parameters like, current densities, temperatures, electrical conductivity, magnetic field and high velocities of plasmas pose many challenges in modeling vacuum arcs. Present work consists of solution of two-fluid equations for electrons and ions. In addition to fluid equations, Maxwell´s equations are solved to obtain the Lorentz force and Joule heat which are implemented as source to momentum and energy equations respectively. Simulation results show the variation of the ion and electron number densities, their temperatures, velocities and magnetic flux.
Keywords
computational fluid dynamics; electrical conductivity; numerical analysis; plasma density; plasma magnetohydrodynamics; plasma temperature; plasma transport processes; vacuum arcs; Joule heat; Lorentz force; Maxwell equations; computational fluid dynamics analysis; contact material; current densities; diffuse vacuum arcs; electrical conductivity; electron number density; electron temperature; energy equation; fluid equations; local evaporation; magnetic field; magnetic flux; momentum equation; two-dimensional axisymmetric numerical model; two-fluid equations; Current density; Equations; Magnetic fields; Mathematical model; Plasma temperature; Vacuum arcs;
fLanguage
English
Publisher
ieee
Conference_Titel
Discharges and Electrical Insulation in Vacuum (ISDEIV), 2014 International Symposium on
Conference_Location
Mumbai
Print_ISBN
978-1-4799-6750-6
Type
conf
DOI
10.1109/DEIV.2014.6961681
Filename
6961681
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