DocumentCode :
1588239
Title :
Thermal stress test for PLED
Author :
Yap, B.K. ; Koh, S.P. ; Tiong, S.K. ; Ong, C.N.
Author_Institution :
Electron. & Commun. Eng. Dept, Univ. Tenaga Nasional, Kajang, Malaysia
fYear :
2010
Firstpage :
370
Lastpage :
372
Abstract :
This work presents thermal stability studies of PLEDs involving the comparison of electrical performance before and after thermal treatment. Two cycles of continuous thermal stress test from room temperature to 100 deg Celsius did not significantly affect the total photoluminescence intensity from the light-emitting polymer in the PLED suggesting that the layer of light-emitting polymer is intact. However, the rapid degradation of the electrical performance of the PLED right after the first cycle of thermal stress test suggests that the electrodes have degraded hence hindering charge injection into the polymeric layer.
Keywords :
organic light emitting diodes; photoluminescence; thermal stability; thermal stresses; PLED; charge injection; continuous thermal stress test; electrodes; light-emitting polymer; photoluminescence intensity; temperature 100 degC; temperature 293 K to 298 K; thermal stability; thermal treatment; Cathodes; Charge coupled devices; Electrodes; Electronic equipment testing; Indium tin oxide; Photoluminescence; Polymer films; Temperature measurement; Thermal degradation; Thermal stresses;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Electronics (ICSE), 2010 IEEE International Conference on
Conference_Location :
Melaka
Print_ISBN :
978-1-4244-6608-5
Type :
conf
DOI :
10.1109/SMELEC.2010.5549354
Filename :
5549354
Link To Document :
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