Title :
Microstructure, tensile strength and anti-welding property of Cu-25CrTe alloy contact materials
Author :
Baihe Miao ; Jianping He ; Guoxun Liu ; Wenbin Wang ; Xiaojun Wang ; Kai Liu
Author_Institution :
Univ. of Sci. & Technol. Beijing, Beijing, China
fDate :
Sept. 28 2014-Oct. 3 2014
Abstract :
The microstructure and Te distribution in Cu-25CrTe contact materials doped with 0.01, 0.6 and 2.0 pct Te respectively were investigated by TEM with an EDS system. Meanwhile the tensile strength of eight Cu-25CrTe contact materials at ambient temperature was measured. It is shown that Te atoms segregate at the interface of Cu/Cr phases in the Cu-25CrTe materials; a globular CrCu2Te 2 intermetallic compound phase is formed in the Cu-25Cr doped with 2.0 pct Te. The tensile strength of Cu-25CrTe decreases with increasing Te-content. Thereby, anti-welding properties of Cu-25CrTe contact materials were evaluated further for VCB engineering applications.
Keywords :
X-ray chemical analysis; chromium alloys; copper; crystal microstructure; mechanical contact; tellurium alloys; tensile strength; transmission electron microscopy; welding; Cu-Cr phase interface; Cu-CrTe; EDX; TEM; VCB engineering application; antiwelding property; doped contact materials; globular intermetallic compound phase; microstructures; tensile strength; Compounds; Contacts; Intermetallic; Materials; Microstructure; Welding;
Conference_Titel :
Discharges and Electrical Insulation in Vacuum (ISDEIV), 2014 International Symposium on
Conference_Location :
Mumbai
Print_ISBN :
978-1-4799-6750-6
DOI :
10.1109/DEIV.2014.6961715
