DocumentCode :
158937
Title :
Protection of ion source electronics against dynamic conditions in ion source at elevated potentials in mass spectrometers
Author :
Gulhane, Milind ; Kumar, Yogesh ; Nataraju, V. ; Saha, Tapan K. ; Gupta, Suneet K.
fYear :
2014
fDate :
Sept. 28 2014-Oct. 3 2014
Firstpage :
633
Lastpage :
635
Abstract :
Failure in floating electronics (components) at elevated potentials of ion sources (like thermal ionization source, electron impact ionization source) in magnetic sector mass spectrometers, may occur due to random heavy discharges within the ion source region. Discharge is generally caused by the dynamic phenomenon like pressure fluctuations in the ion source, ion formation, source magnet movement (changes in the magnetic field) leading to sudden rise in emission current etc. Different protection topologies like short circuit protection, overvoltage protection, introduction of transient voltage suppressors (transorbs), and source resistance were employed to minimize the damage of electrode power supplies under normal conditions. Additionally, resistive ballast was added to avoid damage of the electronics due to discharges under floating conditions at high voltage. Implementation of the above mentioned protection methods ensured fault free performance of ion source electronic units over a longer period as compared to that without the protections.
Keywords :
electrodes; ion sources; mass spectrometers; nuclear electronics; electrode power supply damage minimization; electron impact ionization source; electronic damage avoidance; elevated ion source potential; floating electronic failure; high voltage floating condition discharge; ion formation; ion source dynamic condition; ion source dynamic phenomenon like pressure fluctuation; ion source electronic protection; ion source electronic unit fault free performance; ion source region random heavy discharge; magnetic field change; magnetic sector mass spectrometer; mass spectrometer elevated potential; normal condition; overvoltage protection; protection method implementation; protection topology; resistive ballast; short circuit protection; source magnet movement; source resistance; sudden emission current rise; thermal ionization source; transient voltage suppressor introduction; Discharges (electric); Electrodes; Electrostatic discharges; Fault location; Ion sources; Resistors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Discharges and Electrical Insulation in Vacuum (ISDEIV), 2014 International Symposium on
Conference_Location :
Mumbai
Print_ISBN :
978-1-4799-6750-6
Type :
conf
DOI :
10.1109/DEIV.2014.6961762
Filename :
6961762
Link To Document :
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