On-wafer characterization de-embedding and transmission line optimization on silicon for millimeter-wave applications

Author

Rockwell, Stephen K. ; Bosco, Bruce A.

Author_Institution

Motorola Labs., Tempe, AZ, USA

fYear

2005

Firstpage

561

Lastpage

564

Abstract

The design and implementation of transmission line based calibration standards, suitable for de-embedding on-wafer active and passive elements for millimeter-wave applications on silicon BiCMOS backend process technology, is investigated. Loss mechanisms, accuracy requirements, layout considerations, and impedance dependent characteristics of transmission line structures are discussed. The application of popular on-wafer, in situ calibration de-embedding approaches is evaluated. Methods to improve backend process technology for millimeter-wave applications are suggested, based upon transmission modeling using EM simulation tools. Modeled versus measured results are presented in support of conclusions.

Keywords

BiCMOS integrated circuits; MIMIC; calibration; circuit optimisation; coplanar waveguides; integrated circuit measurement; integrated circuit modelling; microstrip lines; BiCMOS backend process technology; Si; coplanar waveguides; impedance dependent characteristics; microstrip transmission lines; millimeter-wave IC; on-wafer characterization; on-wafer de-embedding; transmission line based calibration standards; transmission line optimization; transmission modeling; CMOS technology; Calibration; Distributed parameter circuits; Impedance; Integrated circuit interconnections; Millimeter wave measurements; Millimeter wave radar; Millimeter wave technology; Silicon; Transmission lines;

fLanguage

English

Publisher

ieee

Conference_Titel

Radio Frequency integrated Circuits (RFIC) Symposium, 2005. Digest of Papers. 2005 IEEE

ISSN

1529-2517

Print_ISBN

0-7803-8983-2

Type

conf

DOI

10.1109/RFIC.2005.1489875

Filename

1489875