• DocumentCode
    1590435
  • Title

    Evaluating the impact of communication latency on applications running over on-chip multiprocessing platforms: A layered approach

  • Author

    Indrusiak, Leandro Soares ; Ost, Luciano Copello ; Moraes, Fernando Gehm ; Määtta, Sanna ; Nurmi, Jari ; Möller, Leandro ; Glesner, Manfred

  • Author_Institution
    Comput. Sci. Dept., Univ. of York, York, UK
  • fYear
    2010
  • Firstpage
    148
  • Lastpage
    153
  • Abstract
    The evaluation of communication latency in multiprocessor platforms requires the profiling of the application, the description of the architecture of the platform and of the mapping of application tasks onto processing cores. In this paper, we describe a layered approach that allows application developers to obtain accurate figures for communication latency from an abstract model of the application functionality. A complete separation of concerns is a critical part of this approach, so the major contribution here is the definition of interfaces between different layers: an abstract application model, its executable counterpart, the mapping heuristic and the multiprocessor platform model. Case studies with a realistic application and a NoC-based multiprocessor platform show the potential of the proposed approach using two different system evaluation techniques: simulation and static analysis.
  • Keywords
    integrated circuit design; multiprocessing systems; network-on-chip; ESL design; NoC-based multiprocessor platform model; application functionality; communication latency; on-chip multiprocessing platforms; simulation analysis; static analysis; Analytical models; Application software; Computer science; Delay; Informatics; Microelectronics; Network-on-a-chip; Real time systems; System-on-a-chip; Unified modeling language; ESL design; UML; actors; on-chip multiprocessing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Industrial Informatics (INDIN), 2010 8th IEEE International Conference on
  • Conference_Location
    Osaka
  • Print_ISBN
    978-1-4244-7298-7
  • Type

    conf

  • DOI
    10.1109/INDIN.2010.5549443
  • Filename
    5549443