Title :
Temperature controlled multi-oven for MTF tests
Author :
Ciofi, C. ; Giannetti, R. ; Neri, B.
Author_Institution :
Pisa Univ., Italy
Abstract :
The design and principle of operation of a measurement system primarily intended for performing MTF (median time to failure) tests on metallic interconnections of integrated circuit is presented. The instrument is different from other similar equipment in that a separate heating system is used for each sample. This approach will allow one, probably for the first time, to perform such tests in the ideal conditions of constant current and temperature for all the samples
Keywords :
failure analysis; integrated circuit metallisation; integrated circuit reliability; integrated circuit testing; life testing; ovens; MTF tests; measurement system; median time to failure tests; metallic IC interconnections; separate heating system; temperature controlled multi-oven; Circuit testing; Heating; Instruments; Integrated circuit interconnections; Integrated circuit measurements; Integrated circuit testing; Performance evaluation; System testing; Temperature control; Time measurement;
Conference_Titel :
Instrumentation and Measurement Technology Conference, 1998. IMTC/98. Conference Proceedings. IEEE
Conference_Location :
St. Paul, MN
Print_ISBN :
0-7803-4797-8
DOI :
10.1109/IMTC.1998.676933
