• DocumentCode
    1590553
  • Title

    Growth of AlxGa1−xN epitaxial thin film on sapphire substrate by plasma assisted metal organic chemical vapor deposition (PA-MOCVD)

  • Author

    Arsyad, Fitri S. ; Arifin, P. ; Barmawi, M. ; Budiman, M. ; Sukirno ; Supu, A.

  • Author_Institution
    Dept. of Phys., Sriwijaya Univ., Palembang, Indonesia
  • fYear
    2010
  • Firstpage
    64
  • Lastpage
    67
  • Abstract
    This paper reported the study of growth of AlxGa1-xN thin film on a-plane sapphire substrate using plasma assisted metal organic chemical vapor deposition (PA-MOCVD). We have successfully growth the Al content AlGaN alloys and investigated the influence of TMA/TMAl+TMGa flow rate ratio to their crystal structure and surface morphology. From S EM image and XRD measurement, the AlGaN films grown with TMA/TMAl+TMGa flow rate ratio of 20% have single crystal orientation, homogeneous and smoother surface morphology. From ED X microanalysis results, all of the AlGaN alloys have high Al content. The Al content of the AlGaN alloys with TMA/TMAl+TMGa flow rate ratio of 20%, 30%, and 40% is about x = 0.5, 0.6, and 0.65, respectively and grown at the growth temperature about of 700°C.
  • Keywords
    III-V semiconductors; MOCVD coatings; X-ray chemical analysis; X-ray diffraction; aluminium compounds; epitaxial growth; plasma CVD coatings; sapphire; scanning electron microscopy; wide band gap semiconductors; AlxGa1-xN; EDX microanalysis; SEM image; XRD measurement; crystal structure; epitaxial thin film growth; plasma assisted metal organic chemical vapor deposition; sapphire substrate; surface morphology; Aluminum alloys; Aluminum gallium nitride; Chemical vapor deposition; Organic chemicals; Plasma chemistry; Plasma measurements; Sputtering; Substrates; Surface morphology; X-ray scattering; AlxGa1-xN; EDX; PA-MOCVD; SEM; XRD;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Electronics (ICSE), 2010 IEEE International Conference on
  • Conference_Location
    Melaka
  • Print_ISBN
    978-1-4244-6608-5
  • Type

    conf

  • DOI
    10.1109/SMELEC.2010.5549448
  • Filename
    5549448