Title :
High-linearity and temperature-insensitive 2.4 GHz SiGe power amplifier with dynamic-bias control
Author :
Hua, Wei-Chun ; Lai, Hung-Hui ; Lin, Po-Tsung ; Liu, Chee Wee ; Yang, Tzu-Yi ; Ma, Gin-Kou
Author_Institution :
Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
Abstract :
A high-linearity and temperature-insensitive 2.4 GHz power amplifier (PA) with dynamic-bias control is realized in a SiGe HBT technology with 0.9 μm emitter width. Due to the bias linearization, the P1dB of 27 dBm is only 0.5 dB lower than Psat, which is the record low to the best of our knowledge. With simple temperature-insensitive bias, the total current deviations from the room temperature values are smaller than 6% and 10% at the linear Pout (24/20 dBm) for 802.11b and 802.11g, respectively, at the test temperatures from 0°C to 85°C. The integrated power detector has a wide dynamic range of 20 dB. The DC current can be reduced to 53 mA and the power-added-efficiency (PAE) can be enhanced up to 3 times at low Pout level under dynamic-bias control operation, and meanwhile the 802.11b/g linearity requirements are achieved. This design is most suitable for the future 802.11n application due to its high linearity.
Keywords :
Ge-Si alloys; UHF integrated circuits; UHF power amplifiers; bipolar analogue integrated circuits; electric current; integrated circuit design; wireless LAN; 0 to 85 C; 0.9 pm; 2.4 GHz; 53 mA; DC current; HBT technology; IEEE 802.11b; IEEE 802.11g; IEEE 802.11n; SiGe; WLAN; bias linearization; current deviations; dynamic-bias control; high-linearity temperature-insensitive power amplifier; integrated power detector; power-added-efficiency; silicon-germanium power amplifier; temperature-insensitive power amplifier; Detectors; Germanium silicon alloys; Heterojunction bipolar transistors; High power amplifiers; Inductors; Linearity; Silicon germanium; Standards development; Temperature control; Wireless LAN;
Conference_Titel :
Radio Frequency integrated Circuits (RFIC) Symposium, 2005. Digest of Papers. 2005 IEEE
Print_ISBN :
0-7803-8983-2
DOI :
10.1109/RFIC.2005.1489887