• DocumentCode
    1591624
  • Title

    Mass-producible monolithic silicon probes for scanning probe microscopes

  • Author

    Liu, Chang

  • Author_Institution
    Microelectron. Lab., Illinois Univ., Champaign, IL, USA
  • Volume
    2
  • fYear
    1998
  • Firstpage
    1381
  • Abstract
    This paper describes the design, fabrication, and characterization of monolithically micromachined silicon probes for Scanning Probe Microscopes (SPM) applications. Each probe contains three integral components: an atomically sharp tip, a supporting flexural beam and a handle for packaging. A new fabrication technology for producing highly uniform devices has been developed, in which robust processing steps such as oxidation sharpening and etch stop are utilised to replace steps that require critical timing. Improved device uniformity and mass-producibility include the following aspects: (1) wafer- as well as batch-scale uniformity of tip/beam geometry, (2) robust compensation of uncertainty and inaccuracy in process and materials, and (3) no requirement for post-process assembly (e.g. wafer-wafer bonding). The flexural beam exhibits good mechanical characteristics (high resonant frequency, zero intrinsic stress, low creep and fatigue) due to the monolithic single crystal silicon material used. Mechanical characteristics of the probes, including resonant frequencies and quality factor, have been experimentally determined using a laser Doppler vibrometer. The operation of probes has been successfully demonstrated in force feedback configuration (AFM mode)
  • Keywords
    Doppler measurement; Q-factor measurement; elemental semiconductors; integrated circuit technology; integrated circuit testing; light interferometry; mechanical variables measurement; microsensors; scanning probe microscopy; semiconductor technology; silicon; Si; Si monolithic probes; Si single crystal; atomically sharp tip; batch-scale uniformity; etch stop; flexural beam; force feedback configuration; laser Doppler vibrometer; mechanical characteristics; oxidation sharpening; packaging; post-process assembly; quality factor; resonant frequencies; robust compensation; robust processing; scanning probe microscopes; supporting flexural beam; tip/beam geometry; wafer-uniformity; Atomic beams; Atomic force microscopy; Crystalline materials; Fabrication; Oxidation; Packaging; Resonant frequency; Robustness; Scanning probe microscopy; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Instrumentation and Measurement Technology Conference, 1998. IMTC/98. Conference Proceedings. IEEE
  • Conference_Location
    St. Paul, MN
  • ISSN
    1091-5281
  • Print_ISBN
    0-7803-4797-8
  • Type

    conf

  • DOI
    10.1109/IMTC.1998.676980
  • Filename
    676980