Abstract :
Topics covered in this conference include: Application of microelectronics in product development; Device modeling, simulation and design; Device packaging & testing; Device physics and characterization; Material and new fabrication facilities technologies; Micromachining, microsensors and MEMS; Microwave device and MMIC; Opto-electronics and photonics technology; Process technology (CMOS,bipolar,BiCMOS,GaAs, etc); Reliability and failure analysis; Training and human resource development in microelectronics industry; Wafer Fabrication facilities and technology; Nano Technology; and Nano Electronics.
