DocumentCode
159271
Title
High tensile strain transfer into germanium microdisks using all-around strained SiN
Author
Ghrib, A. ; El Kurdi, M. ; Prost, M. ; Sauvage, Sebastien ; Beaudoin, G. ; Largeau, Ludovic ; Chaigneau, Marc ; Ossikovski, Razvigor ; Sagnes, I. ; Boucaud, P.
Author_Institution
Inst. d´Electron. Fondamentale, Univ. Paris Sud, Orsay, France
fYear
2014
fDate
27-29 Aug. 2014
Firstpage
229
Lastpage
230
Abstract
We demonstrate an optimized homogeneous tensile-strain transfer into germanium microdisks up to around 1.5% biaxial strain. This is achieved by combining a bonding technique and an all-around deposition of strained silicon nitride.
Keywords
bonding processes; germanium; integrated optics; microcavity lasers; microdisc lasers; optical fabrication; optical materials; piezo-optical effects; semiconductor lasers; silicon compounds; Ge; SiN; all-around deposition; all-around strained SiN; biaxial strain; bonding technique; germanium microdisks; high tensile strain transfer; optimized homogeneous tensile-strain transfer; strained silicon nitride; Germanium; Optics; Photonics; Pump lasers; Silicon compounds; Tensile strain; Raman; Silicon photonics; germanium; integrated laser; microdisk cavity; photoluminescence; strain engineering;
fLanguage
English
Publisher
ieee
Conference_Titel
Group IV Photonics (GFP), 2014 IEEE 11th International Conference on
Conference_Location
Paris
Print_ISBN
978-1-4799-2282-6
Type
conf
DOI
10.1109/Group4.2014.6961938
Filename
6961938
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