Title :
Flip-chip integration of 4-channel transimpedance amplifier chip on a Si/Ge-based photonic circuit
Author :
Takeda, Kenji ; Usui, Mitsuo ; Okazaki, Kenjiro ; Hiraki, Tatsurou ; Tsuchizawa, Tai ; Nishi, Hidetaka ; Kou, Rai ; Honda, Kazuhiro ; Fukuda, Hiroshi ; Ishikawa, Yozo ; Wada, Kazuyoshi ; Yamada, Koji ; Nogawa, Masafumi ; Yamamoto, Takayuki
Author_Institution :
NTT Microsyst. Integration Labs., NTT Corp., Atsugi, Japan
Abstract :
We have developed a photonic receiver in which a 4-channel transimpedance amplifier (TIA) chip is integrated on a Si/Ge-based photonic circuit by using flip-chip bonding. The TIA outputs exhibit a clearly opened 25-Gbit/s eye pattern.
Keywords :
flip-chip devices; germanium; integrated optics; operational amplifiers; optical receivers; photodiodes; silicon; 4-channel transimpedance amplifier chip; Si-Ge; Si/Ge-based photonic circuit; TIA outputs; bit rate 25 Gbit/s; eye pattern; flip-chip bonding; flip-chip integration; photonic receiver; Bandwidth; Bonding; Flip-chip devices; Frequency response; Photonics; Receivers; Silicon; Ge phododiode; Si photonics; flip-chip bonding; transimpedance amplifier;
Conference_Titel :
Group IV Photonics (GFP), 2014 IEEE 11th International Conference on
Conference_Location :
Paris
Print_ISBN :
978-1-4799-2282-6
DOI :
10.1109/Group4.2014.6961948
