DocumentCode :
1593216
Title :
Novel Failure Isolation Techniques for Circuits Sensitive to Microprobe
Author :
Fan, DiWei ; Wu, Miao ; Yu, Joe ; Wang, Winter ; Wu, Chunlei ; Li, Jinglong ; Tian, Li
Author_Institution :
Freescale Semicond. (China) Ltd., Tianjin, China
fYear :
2012
Firstpage :
401
Lastpage :
404
Abstract :
Voltage measurement of test pad directly by microprobe is typical technique in circuit isolation stage of failure analysis. But in some special circuits which are sensitive to microprobe, the voltage of some test pads will change when microprobe needle touches the test pads. Hence it is necessary to develop new measurement skills to confirm test pad status instead of measuring voltage directly. This paper introduces several novel measurement methods to solve this issue and demonstrates these skills with real cases.
Keywords :
failure analysis; integrated circuit testing; probes; voltage measurement; circuit isolation stage; failure analysis; failure isolation; microprobe needle; sensitive circuit; test pad; voltage measurement; Current measurement; Electrical resistance measurement; Fluid flow measurement; Needles; Resistance; Semiconductor device measurement; Voltage measurement; Failure analysis; microprobe; sensitive circuit;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Intelligent System Design and Engineering Application (ISDEA), 2012 Second International Conference on
Conference_Location :
Sanya, Hainan
Print_ISBN :
978-1-4577-2120-5
Type :
conf
DOI :
10.1109/ISdea.2012.399
Filename :
6173231
Link To Document :
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