Title :
Highly Thermally Stable and Reproducible of ALD RuO2 Nanocrystal Floating Gate Memory Devices with Large Memory Window and Good Retention
Author :
Maikap, S. ; Banerjee, W. ; Tzeng, P.J. ; Wang, T.Y. ; Lin, C.H. ; Tien, T.C. ; Lee, L.S. ; Yang, J.R. ; Kao, M.J. ; Tsai, M.J.
Author_Institution :
Dept. of Electron. Eng., Chang Gung Univ., Taoyuan
Abstract :
Highly thermally stable (~1000degC) and reproducible of ALD RuO2 nanocrystal floating gate memory devices with a large hysteresis memory window of DeltaV ap 14.6 V under a gate voltage of plusmn10 V have been observed. The memory window of DeltaV ap 4.2 V under a small gate voltage of plusmn3 V is also observed. Both program and erase speeds of DeltaVFB>1 V@100 mus are achieved under Fowler-Nordheim injections. Excellent endurance of DeltaV ap 8.5V, before and after 104 cycles and a large memory window of DeltaV ap 4.9 V after 10 years of retention (9% charge loss at 20degC and -20% charge loss at 85degC) are obtained. The high-performance ALD RuO2 nanocrystal flash memory devices can be operated below 5 V.
Keywords :
alumina; atomic layer deposition; flash memories; hafnium compounds; high-k dielectric thin films; nanoelectronics; nanostructured materials; ruthenium compounds; thermal stability; ALD; Fowler-Nordheim injections; HfO2-Al2O3; RuO2; atomic layer deposition; charge loss; data retention; endurance capacity; erasing speed; flash memory devices; hysteresis memory window; program speed; temperature 20 C; temperature 85 C; thermally stable nanocrystal floating gate memory devices; Capacitance-voltage characteristics; Hafnium oxide; High K dielectric materials; High-K gate dielectrics; Hysteresis; Leakage current; Nanocrystals; Nonvolatile memory; Temperature; Voltage;
Conference_Titel :
VLSI Technology, Systems and Applications, 2008. VLSI-TSA 2008. International Symposium on
Conference_Location :
Hsinchu
Print_ISBN :
978-1-4244-1614-1
Electronic_ISBN :
1524-766X
DOI :
10.1109/VTSA.2008.4530793