DocumentCode :
1593313
Title :
Highly Reliable MA BE-SONOS (Metal-Al2O3 Bandgap Engineered SONOS) Using a SiO2 Buffer Layer
Author :
Lai, Sheng-Chih ; Lue, Hang-Ting ; Liao, Chien-Wei ; Wu, Tai-Bor ; Yang, Ming-Jui ; Lue, Yi-Hsien ; Hsieh, Jung-Yu ; Wang, Szu-Yu ; Luo, Guang-Li ; Chien, Chao-Hsin ; Hsieh, Kuang-Yeu ; Liu, Rich ; Lu, Chih-Yuan
Author_Institution :
Macronix Int. Co. Ltd., Hsinchu
fYear :
2008
Firstpage :
58
Lastpage :
59
Abstract :
A metal-high-k bandgap-engineered SONOS (MA BE-SONOS) with an additional SiO2 buffer layer is proposed. The thin SiO2 (5 ~ 6 nm) layer between the high-k (Al2O3) and nitride serves to prevent shallow trap generation. Contrary to the previously proposed MANOS or MA BE-SONOS devices using a simple high-k top dielectric, this composite structure eliminates the unstable high-k/nitride interface. Experimental results show that this new device can well suppress the erase saturation, just like MANOS. On the other hand, the data retention is greatly improved, owing to the much more stable interface between the nitride-trapping layer and top oxide. Very large memory window (> 7 V) with excellent cycling endurance, read disturb immunity, and data retention has been successfully demonstrated. Theoretical model is also proposed to explain the principle of this device.
Keywords :
NAND circuits; alumina; flash memories; high-k dielectric thin films; integrated circuit reliability; silicon compounds; Al2O3-Si-SiO-SiN; NAND flash scaling mechansim; SiO2; buffer layer; composite structure; cycling endurance; data retention; erase saturation suppression; high-k dielectrics; memory window; nitride-trapping layer; read disturb immunity; reliable metal-high-k bandgap-engineered SONOS; stable interface structure; Buffer layers; Degradation; Dielectric devices; Electrons; High K dielectric materials; High-K gate dielectrics; Photonic band gap; SONOS devices; Tunneling; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
VLSI Technology, Systems and Applications, 2008. VLSI-TSA 2008. International Symposium on
Conference_Location :
Hsinchu
ISSN :
1524-766X
Print_ISBN :
978-1-4244-1614-1
Electronic_ISBN :
1524-766X
Type :
conf
DOI :
10.1109/VTSA.2008.4530797
Filename :
4530797
Link To Document :
بازگشت