DocumentCode :
1595425
Title :
Progress Towards A High-Resolution Retinal Prosthesis
Author :
Weiland, James D. ; Fink, Wolfgang ; Humayun, Mark ; Liu, Wentai ; Rodger, Damien C. ; Tai, Yu- Chong ; Tarbell, Mark
Author_Institution :
Dept. of Ophthalmology, Univ. of Southern California, Los Angeles, CA
fYear :
2006
Firstpage :
7373
Lastpage :
7375
Abstract :
Simulations of artificial vision suggest that 1000 electrodes may be required to restore vision to individuals with diseases of the outer retina. In order to achieve such an implant, new technology is needed, since the state-of-the-art implantable neural stimulator has at most 22 contacts with neural tissue. Considerable progress has been made towards that goal with the development of image processing, microelectronics, and polymer based electrodes and interconnects. An image processing system has been realized that is capable of real-time implementation of image decimation and filtering (for example, edge detection). Application specific integrated circuits (ASICs) have been designed and tested to demonstrate closed loop power control and efficient microstimulation. A novel packaging process has been developed that is capable of simultaneously forming a receiver coil, interconnects, and stimulating electrodes
Keywords :
application specific integrated circuits; eye; medical image processing; neuromuscular stimulation; prosthetics; vision defects; application specific integrated circuits; artificial vision; closed loop power control; image decimation; image processing; implantable neural stimulator; microstimulation; neural tissue; retinal prosthesis; Circuit testing; Diseases; Electrodes; Image processing; Image restoration; Implants; Integrated circuit interconnections; Neural prosthesis; Prosthetics; Retina; electrical stimulation; microsystems; neural prostheses; retinal prosthesis;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Engineering in Medicine and Biology Society, 2005. IEEE-EMBS 2005. 27th Annual International Conference of the
Conference_Location :
Shanghai
Print_ISBN :
0-7803-8741-4
Type :
conf
DOI :
10.1109/IEMBS.2005.1616215
Filename :
1616215
Link To Document :
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