Thermal and electrical ageing of DBC substrates

Author

Catellani, S. ; Crébier, J.C. ; Schaeffer, C. ; Marsala, T.

Author_Institution

Lab. d´´Electrotechnique de Grenoble, ESNIEG, Saint Martin d´´Heres, France

Volume

4

fYear

2001

fDate

6/23/1905 12:00:00 AM

Firstpage

1955

Abstract

In LEG-INPG, a test bench has been developed in order to identify and to study ageing indicators of DBC (direct bond copper) used in power electronic modules. For reproducibility purposes, the approach that has been considered consists in a macroscopic analysis. As a result, partial discharges are not observed nor quantified. In this paper, the leakage current of DBC is used as the main ageing indicator. First the bench, then the testing conditions and finally the limitations are presented. It relays on thermal and electrical ageing. Then, the step by step, study of the indicator is given. The progress of the study is given, and first results and comments are provided

Keywords

ageing; copper; partial discharges; printed circuit testing; substrates; LEG-INPG; ageing indicators; direct bond copper; electrical ageing; leakage current; macroscopic analysis; partial discharges; power electronic modules; test bench; testing conditions; thermal; Aging; Aluminum; Copper; Leakage current; Partial discharges; Power electronics; Temperature; Testing; Thermal management of electronics; Voltage;

fLanguage

English

Publisher

ieee

Conference_Titel

Power Electronics Specialists Conference, 2001. PESC. 2001 IEEE 32nd Annual

Conference_Location

Vancouver, BC

ISSN

0275-9306

Print_ISBN

0-7803-7067-8

Type

conf

DOI

10.1109/PESC.2001.954408

Filename

954408