Title :
A novel temperature-dependent Gummel-Poon based large signal for accurate modeling of heterojunction bipolar transistors
Author :
Issaoun, A. ; Dousset, David ; Kouki, A.B. ; Ghannouchi, F.M.
Author_Institution :
Ecole de Technol. Super., Montreal, Que., Canada
Abstract :
A complete, simple, but accurate, temperature-dependent Gummel-Poon based model for heterojunction bipolar transistors is proposed. Polynomial and power relations are used to model the temperature dependence of the diode ideality coefficients and of the thermal resistance, respectively. The model includes Kirk and Early effects which are modeled using new approaches. The model parameters are extracted from Gummel forward and reverse measurements at various junction temperatures and fly-back measurements to determine with accuracy emitter and collector resistances. The model, implemented in an Agilent ADS circuit simulator, using a symbolically defined device (SDD), is verified by comparing the simulated and measured data in DC, multi-bias small-signal s-parameters and large-signal microwave power characteristics for a 2×20 μm2 emitter area InGaP/GaAs transistor.
Keywords :
S-parameters; gallium arsenide; gallium compounds; heterojunction bipolar transistors; indium compounds; microwave bipolar transistors; polynomials; semiconductor device models; thermal resistance; 2 micron; 20 micron; Agilent ADS circuit simulator; Early effect; InGaP-GaAs; Kirk effect; collector resistance; diode ideality coefficients; emitter resistance; fly-back measurements; heterojunction bipolar transistors; junction temperature; large signal; large-signal microwave power characteristics; polynomial relations; power relations; small-signal s-parameters; symbolically defined device; temperature dependence; temperature-dependent Gummel-Poon based model; thermal resistance; transistor models; Circuit simulation; Data mining; Diodes; Electrical resistance measurement; Heterojunction bipolar transistors; Kirk field collapse effect; Polynomials; Temperature dependence; Temperature measurement; Thermal resistance;
Conference_Titel :
Electrical and Computer Engineering, 2004. Canadian Conference on
Print_ISBN :
0-7803-8253-6
DOI :
10.1109/CCECE.2004.1344950