DocumentCode :
1597039
Title :
Synaptic Connectivity of a Low Density Patterned Neuronal Network Produced on the Poly-L-Lysine Stamped Microelectrode Array
Author :
Jun, Sang Beom ; Hynd, Matthew ; Dowell-Mesfin, Natalie ; Smith, Karen L. ; Turner, James ; Shain, William ; Kim, Sung June
Author_Institution :
Nano-Bioelectron. & Syst. Res. Center, Seoul
fYear :
2005
fDate :
6/27/1905 12:00:00 AM
Firstpage :
7604
Lastpage :
7607
Abstract :
Rectangular networks of rat hippocampal neurons have been produced on microelectrode arrays (MEAs). The crossing points of networks were located at the recording electrode sites by aligned microcontact printing (muCP) technique. Polydimethysiloxane (PDMS) stamp was fabricated to print fine poly-L-lysine (PLL) patterns of 2 mum-width lines for neurites and 20 mum-diameter circles for cell bodies. Different densities of neurons were applied on the PLL-stamped MEAs to find how a low density of neurons still has the functional connectivity. From the neural network applied with a density of 200 cells/mm2 , we could observe signal propagation among spontaneous activities. Electrical responses were also evoked by 200 muA current pulse stimulation with 50 mus pulse width. Immunocytostaining was employed to identify dendrites, synapses, and nuclei in the patterned neurons
Keywords :
arrays; bioMEMS; bioelectric phenomena; cellular biophysics; microelectrodes; neurophysiology; polymers; soft lithography; 2 mum; 20 mum; 50 mus; cell bodies; dendrites; immunocytostaining; low density patterned neuronal network; microcontact printing; neurites; nuclei; poly-L-lysine stamped microelectrode array; polydimethysiloxane; rat hippocampal neurons; synapses; synaptic connectivity; Adhesives; Biological neural networks; Electrodes; Etching; Gold; Microelectrodes; Neurons; Soft lithography; Space vector pulse width modulation; Titanium;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Engineering in Medicine and Biology Society, 2005. IEEE-EMBS 2005. 27th Annual International Conference of the
Conference_Location :
Shanghai
Print_ISBN :
0-7803-8741-4
Type :
conf
DOI :
10.1109/IEMBS.2005.1616272
Filename :
1616272
Link To Document :
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