• DocumentCode
    1598471
  • Title

    Dielectric properties of polydicyclopentadiene and polydicyclopentadiene-silica nanocomposite

  • Author

    Yin, Weijun ; Kniajanski, Sergei ; Amm, Bruce

  • Author_Institution
    GE Global Res. Center, Niskayuna, NY, USA
  • fYear
    2010
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    Conventional thermoset materials, such as epoxy, polyester, silicone and polyurethane, have relatively high dielectric losses and high dielectric constants, which are not desirable for a high frequency and high voltage application. Polydicyclopentadiene (PDCPD) is a polyolefinic thermoset material that has outstanding dielectric characteristics: low dielectric constant, low dielectric loss and high breakdown strength that are similar to polypropylene but higher thermal stability similar to epoxy. In addition, it also has great mechanical strength and fracture toughness. Due to its extremely low viscosity, PDCPD is easy to process and has flexibility for various reaction injection moldings. Dielectric performance, such as corona resistance, is further enhanced by PDCPD-nanosilica composites. In this paper, dielectric properties of PDCPD will be presented and discussed.
  • Keywords
    dielectric losses; electric strength; fracture toughness; mechanical strength; nanocomposites; permittivity; polymers; thermal stability; PDCPD-nanosilica composites; corona resistance; dielectric properties; epoxy; extreme low viscosity; fracture toughness; high breakdown strength; high dielectric constants; high dielectric losses; low dielectric constant; low dielectric loss; mechanical strength; polydicyclopentadiene nanocomposite; polydicyclopentadiene-silica nanocomposite; polyester; polyolefinic thermoset material; polyurethane; reaction injection moldings; silicone; thermal stability; Dielectric breakdown; Dielectric constant; Dielectric losses; Dielectric materials; Frequency; High-K gate dielectrics; Injection molding; Thermal stability; Viscosity; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation (ISEI), Conference Record of the 2010 IEEE International Symposium on
  • Conference_Location
    San Diego, CA
  • ISSN
    1089-084X
  • Print_ISBN
    978-1-4244-6298-8
  • Type

    conf

  • DOI
    10.1109/ELINSL.2010.5549749
  • Filename
    5549749