• DocumentCode
    1598880
  • Title

    Analysis of the gap between behavioral and gate level fault simulation

  • Author

    Chen, Chien-In Henry ; Perumal, Sathi

  • Author_Institution
    Dept. of Electr. Eng., Wright State Univ., Dayton, OH, USA
  • fYear
    1993
  • Firstpage
    144
  • Lastpage
    147
  • Abstract
    A VHSIC Hardware Description Language (VHDL) Automatic Test Pattern Generator (ATPG) system to perform behavioral fault modeling and simulation is discussed. The input to the VHDL ATPG system is VHDL at the behavioral level. The behavioral fault model analyzer generates the behavioral faulty files for each fault simulated. The behavioral faulty files are input to both the behavioral fault simulator and the test bench generator. The test bench generator, at the request of user, produces a fault simulation test bench which is applied to the behavioral fault simulator for simulating the faulty files and reference model, respectively. The outputs of these two simulators are compared in the fault simulation comparator which generates the simulation report. The authors analyze the gap of the fault model and fault simulation between the behavioral level and gate level circuit description and show the one to one correspondence with typical examples. The authors demonstrate the effectiveness of behavioral fault modeling and simulation by illustrations of applying the method to practical examples
  • Keywords
    automatic test software; circuit analysis computing; fault diagnosis; hardware description languages; logic CAD; logic gates; logic testing; ATPG; VHDL; behavioral fault modeling; fault simulation test bench; faulty files; gate level fault simulation; reference model; test bench generator; Analytical models; Automatic test pattern generation; Automatic testing; Circuit faults; Circuit simulation; Circuit testing; Computational modeling; Contracts; Hardware design languages; Logic testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    ASIC Conference and Exhibit, 1993. Proceedings., Sixth Annual IEEE International
  • Conference_Location
    Rochester, NY
  • Print_ISBN
    0-7803-1375-5
  • Type

    conf

  • DOI
    10.1109/ASIC.1993.410827
  • Filename
    410827