• DocumentCode
    1599036
  • Title

    Why chips fail: electrostatic discharge

  • Author

    Schwartz, Richard F.

  • Author_Institution
    Dept. of Electr. Eng., State Univ. of New York, Binghamton, NY, USA
  • fYear
    1988
  • fDate
    10/19/1988 12:00:00 AM
  • Firstpage
    92
  • Lastpage
    102
  • Abstract
    Electrostatic discharge (ESD) is becoming increasingly important to electronics as devices become smaller and smaller. It may be the culprit in failure many more times than realized, for it can occur at many stages in the progression from device fabrication to finished equipment assembly and shipping. Many engineers, technicians, and assembly workers are almost completely ignorant of ESD and its threat to the equipment they design and build. The author reviews the subject of ESD, its cause, its effects, and the measures used to combat it
  • Keywords
    electrostatic discharge; failure analysis; integrated circuit testing; chip failure; electronics; electrostatic discharge; Assembly; Books; Design engineering; Electrostatic discharge; Fabrication; Fault location; Financial management; Marketing and sales; Protection; System testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Southern Tier Technical Conference, 1988., Proceedings of the 1988 IEEE
  • Conference_Location
    Binghamton, NY
  • Type

    conf

  • DOI
    10.1109/STIER.1988.95471
  • Filename
    95471