DocumentCode
1599036
Title
Why chips fail: electrostatic discharge
Author
Schwartz, Richard F.
Author_Institution
Dept. of Electr. Eng., State Univ. of New York, Binghamton, NY, USA
fYear
1988
fDate
10/19/1988 12:00:00 AM
Firstpage
92
Lastpage
102
Abstract
Electrostatic discharge (ESD) is becoming increasingly important to electronics as devices become smaller and smaller. It may be the culprit in failure many more times than realized, for it can occur at many stages in the progression from device fabrication to finished equipment assembly and shipping. Many engineers, technicians, and assembly workers are almost completely ignorant of ESD and its threat to the equipment they design and build. The author reviews the subject of ESD, its cause, its effects, and the measures used to combat it
Keywords
electrostatic discharge; failure analysis; integrated circuit testing; chip failure; electronics; electrostatic discharge; Assembly; Books; Design engineering; Electrostatic discharge; Fabrication; Fault location; Financial management; Marketing and sales; Protection; System testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Southern Tier Technical Conference, 1988., Proceedings of the 1988 IEEE
Conference_Location
Binghamton, NY
Type
conf
DOI
10.1109/STIER.1988.95471
Filename
95471
Link To Document