Title :
Why chips fail: electrostatic discharge
Author :
Schwartz, Richard F.
Author_Institution :
Dept. of Electr. Eng., State Univ. of New York, Binghamton, NY, USA
fDate :
10/19/1988 12:00:00 AM
Abstract :
Electrostatic discharge (ESD) is becoming increasingly important to electronics as devices become smaller and smaller. It may be the culprit in failure many more times than realized, for it can occur at many stages in the progression from device fabrication to finished equipment assembly and shipping. Many engineers, technicians, and assembly workers are almost completely ignorant of ESD and its threat to the equipment they design and build. The author reviews the subject of ESD, its cause, its effects, and the measures used to combat it
Keywords :
electrostatic discharge; failure analysis; integrated circuit testing; chip failure; electronics; electrostatic discharge; Assembly; Books; Design engineering; Electrostatic discharge; Fabrication; Fault location; Financial management; Marketing and sales; Protection; System testing;
Conference_Titel :
Southern Tier Technical Conference, 1988., Proceedings of the 1988 IEEE
Conference_Location :
Binghamton, NY
DOI :
10.1109/STIER.1988.95471
