• DocumentCode
    1599119
  • Title

    An improved strategy with transistor re-sizing capability for converting bulk CMOS polygon layout to SOI

  • Author

    Chow, Mike C W ; Chan, Philip C.H.

  • Author_Institution
    Dept. of Electr. & Electron. Eng., Hong Kong Univ., Hong Kong
  • Volume
    4
  • fYear
    1996
  • Firstpage
    767
  • Abstract
    The SOI (Silicon On Insulator) CMOS has many potential advantages over the traditional bulk CMOS circuit as it is free of latch-up and has improved performance and higher packing density. With the recent advances in high-quality thin-film SOI wafer technology, it is becoming a viable technology for ULSI. As SOI emerges as an alternate to bulk CMOS for low power and high-speed applications, an automated methodology will expedite the conversion of existing bulk CMOS designs to SOI CMOS
  • Keywords
    CMOS integrated circuits; integrated circuit layout; silicon-on-insulator; ULSI; bulk CMOS polygon layout; low power high-speed circuit; thin-film SOI wafer technology; transistor re-sizing; Automatic control; CMOS technology; Compaction; MOSFETs; Parasitic capacitance; Pins; Silicon on insulator technology; Substrates; Thin film circuits; Ultra large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Circuits and Systems, 1996. ISCAS '96., Connecting the World., 1996 IEEE International Symposium on
  • Conference_Location
    Atlanta, GA
  • Print_ISBN
    0-7803-3073-0
  • Type

    conf

  • DOI
    10.1109/ISCAS.1996.542137
  • Filename
    542137