DocumentCode :
1599293
Title :
bmodel of secondary ESD for a portable product
Author :
Jiang Xiao ; Pommerenke, D. ; Drewniak, J.L. ; Shumiya, H. ; Yamada, T. ; Araki, K.
Author_Institution :
EMC Lab., Missouri Univ. of Sci. & Technol., Rolla, MO, USA
fYear :
2011
Firstpage :
56
Lastpage :
61
Abstract :
If a non grounded piece of metal is subjected to an ESD, a spark between this metal part and grounded metal parts can occur. This discharge is generally called “secondary ESD”. These secondary ESDs are often very close to the electronics and, as this article shows, can have much higher currents and shorter rise times than the original ESD. For that reason secondary ESD poses a very high risk of causing soft- and hard errors in the affected Device Under Test (DUT). A methodology to model the secondary Electrostatic Discharge (ESD) inside a portable electronic product is presented. It is a hybrid method that combines linear descriptions of the ESD generator and the DUT with the nonlinear spark model and a model for the initiation delay (statistical time lag) of the spark. Measurement results are presented comparing discharge currents and time delays for two cases: secondary discharge between metal rod and ESD target, and inside a portable product.
Keywords :
delays; electrostatic discharge; radiation hardening (electronics); ESD generator; device under test; discharge currents; electrostatic discharge; grounded metal parts; hard errors; initiation delay; linear descriptions; nonlinear spark; portable electronic product; secondary ESD; soft-errors; statistical time lag; time delays; Current measurement; Discharges; Electrostatic discharge; Generators; Metals; SPICE; Voltage measurement; SPICE; Secondary electrostatic discharge; co-simulation; electrostatic discharge (ESD) generator; full wave modeling;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electromagnetic Compatibility (EMC), 2011 IEEE International Symposium on
Conference_Location :
Long Beach, CA, USA
ISSN :
2158-110X
Print_ISBN :
978-1-4577-0812-1
Type :
conf
DOI :
10.1109/ISEMC.2011.6038284
Filename :
6038284
Link To Document :
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