Gas leak rate study of MEMS thin film packages in different environments

Author

Wang, Bingdong ; De Coster, J. ; Wevers, M. ; De Wolf, Ingrid

Author_Institution

Imec, Leuven, Belgium

fYear

2014

fDate

16-18 Sept. 2014

Firstpage

1

Lastpage

4

Abstract

Hermeticity is an important reliability issue for MEMS thin film packages, but difficult to test due to their small volume. We have developed a novel method based on the thin film damping theory to measure the internal pressure and the leak rate of a MEMS thin-film package. The method uses the Focused Ion Beam (FIB) and Laser Doppler Vibrometer (LDV) to monitor the change of the package resonance frequency with pressure. In this paper, using this method, we compare the leak rate of the same MEMS package stored in 3 types of atmosphere: air, 3 bar N₂ and 1 bar He.

Keywords

damping; electronics packaging; focused ion beam technology; measurement by laser beam; micromechanical devices; pressure measurement; reliability; thin film devices; vibration measurement; FIB method; LDV; MEMS thin film packaging; focused ion beam method; gas leak rate study; hermeticity; internal pressure measurement; laser Doppler vibrometer; package resonance frequency; reliability issue; thin film damping theory; Frequency measurement; Micromechanical devices; Packaging; Pressure measurement; Reliability; Resonant frequency; Time measurement;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics System-Integration Technology Conference (ESTC), 2014

Conference_Location

Helsinki

Type

conf

DOI

10.1109/ESTC.2014.6962722

Filename

6962722