DocumentCode :
159965
Title :
On double sided cooling
Author :
Feix, Gudrun ; Hutter, Marcus ; Hoene, E. ; Lang, K.-D.
Author_Institution :
Tech. Univ. Berlin, Berlin, Germany
fYear :
2014
fDate :
16-18 Sept. 2014
Firstpage :
1
Lastpage :
6
Abstract :
Since about 15 years back, there were several attempts to increase power density by double-sided cooling of power semiconductors, mostly by a sandwich stack with two DCBs. This paper gives an overview over the developments and approaches over the last years and some results of another project concerning double sided cooling.
Keywords :
cooling; power semiconductor devices; DCB; double sided cooling; power density; power semiconductor; Assembly; Cooling; Copper; Heating; Inductance; Insulated gate bipolar transistors; Switches;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics System-Integration Technology Conference (ESTC), 2014
Conference_Location :
Helsinki
Type :
conf
DOI :
10.1109/ESTC.2014.6962724
Filename :
6962724
Link To Document :
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