• DocumentCode
    159965
  • Title

    On double sided cooling

  • Author

    Feix, Gudrun ; Hutter, Marcus ; Hoene, E. ; Lang, K.-D.

  • Author_Institution
    Tech. Univ. Berlin, Berlin, Germany
  • fYear
    2014
  • fDate
    16-18 Sept. 2014
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    Since about 15 years back, there were several attempts to increase power density by double-sided cooling of power semiconductors, mostly by a sandwich stack with two DCBs. This paper gives an overview over the developments and approaches over the last years and some results of another project concerning double sided cooling.
  • Keywords
    cooling; power semiconductor devices; DCB; double sided cooling; power density; power semiconductor; Assembly; Cooling; Copper; Heating; Inductance; Insulated gate bipolar transistors; Switches;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics System-Integration Technology Conference (ESTC), 2014
  • Conference_Location
    Helsinki
  • Type

    conf

  • DOI
    10.1109/ESTC.2014.6962724
  • Filename
    6962724
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=159965