DocumentCode :
159978
Title :
Cost components for 3D system integration
Author :
Velenis, Dimitrios ; Detalle, Mikael ; Van Huylenbroeck, Stefaan ; Jourdain, Anne ; Phommahaxay, A. ; Slabbekoorn, John ; Teng Wang ; Marinissen, Erik Jan ; Rebibis, Kenneth June ; Miller, Alice ; Beyer, G. ; Beyne, Eric
Author_Institution :
Imec, Leuven, Belgium
fYear :
2014
fDate :
16-18 Sept. 2014
Firstpage :
1
Lastpage :
5
Abstract :
The cost of 3D process flows is one of the most important aspects for the broader adoption of 3D integration by the semiconductor industry. In this paper the processing cost of the features and components that enable 3D stacking is considered and compared. Different stacking approaches are considered: D2W, W2W and interposer-based stacking. Furthermore, the impact of processing yield and pre-stack testing is evaluated when considering the system integration cost for each one of the 3D stacking methods. In addition the size of the stacked active dies is parameterized and the effect on the system integration cost is explored. Also, the impact of pre-stack testing on interposer in relation to processing yield and the size of the stacked active dies is investigated.
Keywords :
integrated circuit manufacture; three-dimensional integrated circuits; 3D process flows; 3D system integration; D2W stacking; W2W stacking; cost components; interposer-based stacking; prestack testing; processing yield; semiconductor industry; stacked active dies; CMOS integrated circuits; Compounds; Integrated circuit interconnections; Stacking; Substrates; Testing; Three-dimensional displays;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics System-Integration Technology Conference (ESTC), 2014
Conference_Location :
Helsinki
Type :
conf
DOI :
10.1109/ESTC.2014.6962730
Filename :
6962730
Link To Document :
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