DocumentCode
1599826
Title
Noise-aware design for ESD reliability in mixed-signal integrated circuits
Author
Lee, Jaesik ; Huh, Yoonjong ; Bendix, Peter ; Kang, Sung-Mo Steve
Author_Institution
Lucent Technol. Bell Labs., Murray Hill, NJ, USA
fYear
2001
fDate
6/23/1905 12:00:00 AM
Firstpage
437
Lastpage
441
Abstract
The design of electrostatic discharge (ESD) protection network in CMOS technology becomes increasingly more difficult because of shrinking device feature sizes, high operating speed, and system on a chip (SoC) environment. For SoC protection, many additional considerations are required such as complex power bus architecture, area overhead by protection circuits, and noise isolation during normal operations. We present a novel noise-aware design technique for superior noise margin and improved ESD reliability. The use of hierarchical electrostatic discharge (HED) provides a low impedance discharge path for any ESD event with smaller protection circuitry. The estimation of maximum power/ground voltage in digital circuits is helpful to determine an optimal topology of power clamp circuits subject to noise constraints. Experimental results demonstrate the effectiveness of this method
Keywords
CMOS integrated circuits; application specific integrated circuits; electrostatic discharge; integrated circuit design; integrated circuit noise; integrated circuit reliability; mixed analogue-digital integrated circuits; CMOS technology; ESD reliability; SoC environment; device feature sizes; hierarchical electrostatic discharge; low impedance discharge path; maximum power/ground voltage; mixed-signal integrated circuits; noise constraints; noise margin; noise-aware design technique; operating speed; power clamp circuits; CMOS technology; Circuit noise; Electrostatic discharge; Impedance; Integrated circuit technology; Isolation technology; Power system protection; Power system reliability; System-on-a-chip; Working environment noise;
fLanguage
English
Publisher
ieee
Conference_Titel
ASIC/SOC Conference, 2001. Proceedings. 14th Annual IEEE International
Conference_Location
Arlington, VA
Print_ISBN
0-7803-6741-3
Type
conf
DOI
10.1109/ASIC.2001.954741
Filename
954741
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