• DocumentCode
    1599871
  • Title

    Component models insulated with nanocomposite material for environmentally-friendly switchgear

  • Author

    Imai, Takahiro ; Yamazaki, Ken-ichi ; Komiya, Gen ; Murayama, Kiyoko ; Ozaki, Tamon ; Sawa, Fumio ; Kurosaka, Keiichi ; Kitamura, Hitoshi ; Shimizu, Toshio

  • Author_Institution
    Power & Ind. Syst. R&D Center, Toshiba Corp., Fuchu, Japan
  • fYear
    2010
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Nano-clay and micro-silica mixed composites were made for use as insulating materials for environmentally-friendly switchgear. The thermal properties and V-t characteristics of these composites were evaluated under a homogeneous electric field. They were shown to have sufficient thermal and insulation breakdown properties as insulating materials for switchgear. In particular, their average insulation breakdown time was longer than that of conventional filled epoxy at 10 and 20 kV/mm. Moreover, we succeeded in making component models insulated with the composite for switchgear.
  • Keywords
    nanocomposites; switchgear; thermal insulating materials; environmentally friendly switchgear; insulating material; insulation breakdown; nanoclay and microsilica mixed composites; nanocomposite material; Breakdown voltage; Curing; Dielectrics and electrical insulation; Electric breakdown; Electrodes; Epoxy resins; Insulation testing; Nanostructured materials; Switchgear; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation (ISEI), Conference Record of the 2010 IEEE International Symposium on
  • Conference_Location
    San Diego, CA
  • ISSN
    1089-084X
  • Print_ISBN
    978-1-4244-6298-8
  • Type

    conf

  • DOI
    10.1109/ELINSL.2010.5549803
  • Filename
    5549803