• DocumentCode
    1600030
  • Title

    Investigations on the partial discharge behavior of syntactic foam under uniform field stress

  • Author

    Strauchs, Anja ; Mashkin, Andrey ; Schnettler, Armin ; Podlazly, Jörn ; Freiheit-Jensen, Bernd

  • Author_Institution
    Inst. for High Voltage Technol., RWTH Aachen Univ., Aachen, Germany
  • fYear
    2010
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    This paper deals with the partial discharge behavior of epoxy resin filled with hollow glass microspheres. The resulting material, called syntactic foam, is a new composite insulation material which combines advantages of solid and gaseous dielectrics. Specimens of syntactic foam are stressed with uniform AC field stress and the partial discharge activity is simultaneously measured. After the electrical stress the material structure is visualized by Scanning Electron Microscopy. As an essential result of this investigation a theory of the breakdown process of syntactic foam under uniform field stress is developed. Unexpectedly, the breakdown process differs from the one under non-uniform field stress described.
  • Keywords
    composite insulating materials; partial discharges; polymer foams; resins; scanning electron microscopy; breakdown process; composite insulation material; electrical stress; epoxy resin; gaseous dielectrics; hollow glass microspheres; material structure; nonuniform field stress; partial discharge activity; scanning electron microscopy; solid dielectrics; syntactic foam; uniform AC field stress; Composite materials; Dielectric materials; Dielectrics and electrical insulation; Electric breakdown; Epoxy resins; Gas insulation; Glass; Partial discharges; Solids; Stress; hollow microsphere; partial discharge; syntactic foam; uniform field stress;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation (ISEI), Conference Record of the 2010 IEEE International Symposium on
  • Conference_Location
    San Diego, CA
  • ISSN
    1089-084X
  • Print_ISBN
    978-1-4244-6298-8
  • Type

    conf

  • DOI
    10.1109/ELINSL.2010.5549809
  • Filename
    5549809