DocumentCode :
1600229
Title :
An ℋ2-based linear-complexity solution of surface integral equations for 3-D impedance extraction
Author :
Wenwen Chai ; Dan Jiao
Author_Institution :
Sch. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN, USA
fYear :
2011
Firstpage :
249
Lastpage :
253
Abstract :
A new ℋ2-matrix based kernel-independent algorithm of linear complexity is developed for the surface integral equation based impedance extraction of arbitrarily shaped 3-D lossy conductors embedded in dielectric materials. The new algorithm greatly accelerates the iterative solution of a scalar-based surface integral equation for impedance extraction. It outperforms state-of-the-art iterative impedance solvers with fast CPU time, modest memory consumption, and without sacrificing accuracy, for both small and large number of unknowns.
Keywords :
conductors (electric); dielectric materials; electric impedance; integral equations; iterative methods; matrix decomposition; ℋ2-based linear-complexity solution; 3D impedance extraction; arbitrarily shaped 3D lossy conductors; dielectric materials; iterative impedance solvers; surface integral equations; Accuracy; Complexity theory; Conductors; Impedance; Integral equations; Sparse matrices; Surface impedance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electromagnetic Compatibility (EMC), 2011 IEEE International Symposium on
Conference_Location :
Long Beach, CA, USA
ISSN :
2158-110X
Print_ISBN :
978-1-4577-0812-1
Type :
conf
DOI :
10.1109/ISEMC.2011.6038318
Filename :
6038318
Link To Document :
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