• DocumentCode
    1600229
  • Title

    An ℋ2-based linear-complexity solution of surface integral equations for 3-D impedance extraction

  • Author

    Wenwen Chai ; Dan Jiao

  • Author_Institution
    Sch. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN, USA
  • fYear
    2011
  • Firstpage
    249
  • Lastpage
    253
  • Abstract
    A new ℋ2-matrix based kernel-independent algorithm of linear complexity is developed for the surface integral equation based impedance extraction of arbitrarily shaped 3-D lossy conductors embedded in dielectric materials. The new algorithm greatly accelerates the iterative solution of a scalar-based surface integral equation for impedance extraction. It outperforms state-of-the-art iterative impedance solvers with fast CPU time, modest memory consumption, and without sacrificing accuracy, for both small and large number of unknowns.
  • Keywords
    conductors (electric); dielectric materials; electric impedance; integral equations; iterative methods; matrix decomposition; ℋ2-based linear-complexity solution; 3D impedance extraction; arbitrarily shaped 3D lossy conductors; dielectric materials; iterative impedance solvers; surface integral equations; Accuracy; Complexity theory; Conductors; Impedance; Integral equations; Sparse matrices; Surface impedance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility (EMC), 2011 IEEE International Symposium on
  • Conference_Location
    Long Beach, CA, USA
  • ISSN
    2158-110X
  • Print_ISBN
    978-1-4577-0812-1
  • Type

    conf

  • DOI
    10.1109/ISEMC.2011.6038318
  • Filename
    6038318
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1600229