Title :
Reliability characterization of blind-hole vias for a System-in-Foil
Author :
Lorenz, Enno ; Niemann, Nils ; Koyuncu, Metin ; Bock, Karlheinz
Author_Institution :
Corp. Res., Robert Bosch GmbH, Waiblingen, Germany
Abstract :
In this study the bending reliability of an isotropic conductive adhesive (ICA) filled between two printed circuit foils (PCF) as interconnection for a System-in-Foil is evaluated. The filling is realized by a Jet-Dispense process on oxygen plasma treated, as well as non-plasma treated foils. The samples are tested on a bending test setup capable of real-time electrical measurements during bending. A significant improvement of the bending stability is achieved with the plasma treatment process, while the main failure mechanism for the non-plasma treated samples is delamination at the pad-adhesive interface.
Keywords :
bending; circuit reliability; circuit stability; conductive adhesives; delamination; failure analysis; jets; printed circuit interconnections; printed circuit testing; thin film circuits; ICA; PCF interconnection; bending reliability characterization; bending stability; bending testing; blind-hole vias; delamination; failure mechanism; isotropic conductive adhesive; jet-dispense process; nonplasma treatment foil; oxygen plasma treatment; pad-adhesive interface; printed circuit foil interconnection; real-time electrical measurement; system-in-foil; Conductive adhesives; Filling; Materials; Plasmas; Reliability; Resistance; Surface treatment;
Conference_Titel :
Electronics System-Integration Technology Conference (ESTC), 2014
Conference_Location :
Helsinki
DOI :
10.1109/ESTC.2014.6962764
