DocumentCode
1600512
Title
Determination of contact resistance in metal-semiconductor structure
Author
Cheknane, A. ; Charles, Jean-Pierre ; Benyoucef, B. ; Zerdoum, R.
Author_Institution
Mater. & Renewable Energies Laboratory, Aboubaker Belakaid Univ., Tlemcen, Algeria
Volume
1
fYear
2004
Firstpage
322
Abstract
As is well known, the metal-semiconductor contact is clearly a component of any semiconductor device. At the same time, such contacts cannot be assumed to be as low resistance as that two connected metals. In particular, a large mismatch between the Fermi energy of the metal and semiconductor can result is a high-resistance rectifying contact. The proper choice of materials can provide a low resistance ohmic contact. However, for a lot of semiconductors there is no appropriate metal available. Instead one then creates a tunnel contact. Such contact consists of a thin barrier - obtained by heavily-doping the semiconductor - through which carriers can readily tunnel. Contact formation is also affected by thin interfacial layers and is typically finished off with a final anneal or alloy formation after the initial deposition of the metal. In this paper, our work aims to describe each of these contacts; we end this study by determining the contact resistance between a metal and a thin semiconductor layer.
Keywords
Schottky barriers; ohmic contacts; semiconductor junctions; alloy formation; anneal formation; contact formation; contact resistance; metal-semiconductor structure; thin interfacial layers; tunnel contact; Contact resistance; Electrons; Elementary particle vacuum; Inorganic materials; Laboratories; Ohmic contacts; Schottky barriers; Semiconductor devices; Semiconductor materials; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Industrial Technology, 2004. IEEE ICIT '04. 2004 IEEE International Conference on
Print_ISBN
0-7803-8662-0
Type
conf
DOI
10.1109/ICIT.2004.1490307
Filename
1490307
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