Reliability performance of Au-Sn and Cu-Sn wafer level SLID bonds for MEMS

Author

Xu, Hao ; Rautiainen, A. ; Vuorinen, V. ; Osterlund, E. ; Suni, T. ; Heikkinen, H. ; Monnoyer, P. ; Paulasto-Krockel, M.

Author_Institution

Dept. of Electr. Eng. & Autom., Aalto Univ., Aalto, Finland

fYear

2014

fDate

16-18 Sept. 2014

Firstpage

1

Lastpage

5

Abstract

Wafer level Solid-Liquid Interdiffusion (SLID) bonding is used to encapsulate MEMS devices. The metals in SLID bonds can improve the reliability by absorbing mechanical and thermo-mechanical stresses. In this paper, the reliability of wafer level Au-Sn-(Ni) and Cu-Sn SLID bonds was systematically characterized and evaluated with shear/tensile tests, shear fatigue test, mixed flow gas (MFG) test, high temperature storage (HTS) test and thermal shock (TS) test. The failure modes and physical mechanisms were analyzed. Overall, the results demonstrated the high mechanical strength and reliability of SLID bonds. Utilizing the reliability results the design of seal bonds for MEMS encapsulation could be improved.

Keywords

bonding processes; chemical interdiffusion; copper; encapsulation; failure analysis; fatigue testing; gold; micromechanical devices; nickel; reliability; seals (stoppers); shear strength; stress analysis; tensile strength; tensile testing; thermal shock; thermomechanical treatment; tin; wafer level packaging; Au-Sn-Ni; Cu-Sn; HTS testing; MEMS device encapsulation; MFG testing; TS testing; high temperature storage testing; mechanical absorbing; mechanical strength; mixed flow gas testing; reliability performance; shear fatigue testing; shear-tensile testing; solid-liquid interdiffusion; thermal shock testing; thermomechanical stress; wafer level SLID bond; Bonding; Fatigue; Materials; Micromechanical devices; Reliability engineering; Semiconductor device reliability;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics System-Integration Technology Conference (ESTC), 2014

Conference_Location

Helsinki

Type

conf

DOI

10.1109/ESTC.2014.6962771

Filename

6962771