DocumentCode
1600685
Title
Electronic packaging: a systems approach to radiation curing
Author
Gutek, Beth I. ; Strong, Michael R. ; Shirk, Christopher C.
Author_Institution
Dow Corning Corp., Midland, MI, USA
fYear
1988
Firstpage
123
Lastpage
130
Abstract
UV-curable conformal coatings are described which retain the quality performance properties of RTV and heat-cured materials while being capable of curing in seconds at lower heat levels. The significant advantage of these materials is that they are free of solvents. The coatings and the equipment to process them were developed simultaneously. This work demonstrates the benefits of this interactive approach to materials and equipment development.<>
Keywords
environmental testing; materials testing; packaging; printed circuit manufacture; protective coatings; UV-curable conformal coatings; advantage; curing in seconds; electronics packaging; equipment development; free of solvents; heat-cured materials; materials development; performance properties of RTV; systems approach to radiation curing; Acceleration; Curing; Dip coating; Electronics packaging; Ink; Protection; Solvents; Spraying; Ultraviolet sources; Viscosity;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Manufacturing Technology Symposium, 1988, Design-to-Manufacturing Transfer Cycle. Fifth IEEE/CHMT International
Conference_Location
Lake Buena Vista, FL, USA
Type
conf
DOI
10.1109/EMTS.1988.16164
Filename
16164
Link To Document