Title :
Electronic packaging: a systems approach to radiation curing
Author :
Gutek, Beth I. ; Strong, Michael R. ; Shirk, Christopher C.
Author_Institution :
Dow Corning Corp., Midland, MI, USA
Abstract :
UV-curable conformal coatings are described which retain the quality performance properties of RTV and heat-cured materials while being capable of curing in seconds at lower heat levels. The significant advantage of these materials is that they are free of solvents. The coatings and the equipment to process them were developed simultaneously. This work demonstrates the benefits of this interactive approach to materials and equipment development.<>
Keywords :
environmental testing; materials testing; packaging; printed circuit manufacture; protective coatings; UV-curable conformal coatings; advantage; curing in seconds; electronics packaging; equipment development; free of solvents; heat-cured materials; materials development; performance properties of RTV; systems approach to radiation curing; Acceleration; Curing; Dip coating; Electronics packaging; Ink; Protection; Solvents; Spraying; Ultraviolet sources; Viscosity;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1988, Design-to-Manufacturing Transfer Cycle. Fifth IEEE/CHMT International
Conference_Location :
Lake Buena Vista, FL, USA
DOI :
10.1109/EMTS.1988.16164
