• DocumentCode
    1600694
  • Title

    Power noise suppression using Embedded Capacitance Material and Electromagnetic BandGap

  • Author

    Yu Xuequan ; Chen Qilin ; Cao Haiping

  • Author_Institution
    Huawei Technol. Co., Ltd., Shanghai, China
  • fYear
    2011
  • Firstpage
    345
  • Lastpage
    350
  • Abstract
    Power noise suppression on a mixed signal board is investigated in this paper with focus on Embedded Capacitance Material (ECM) and mushroom-type Electromagnetic Bandgap (EBG). ECM and mushroom-type EBG´s working mechanisms and their advantages and disadvantages on high speed power noise suppression are compared though simulation and confirmed on an experimental board. The combined performance of the two techniques is also studied.
  • Keywords
    interference suppression; optical materials; photonic band gap; embedded capacitance material; mixed signal board; mushroom-type electromagnetic bandgap; power noise suppression; Capacitors; Electronic countermeasures; Inductance; Metamaterials; Noise; Periodic structures;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility (EMC), 2011 IEEE International Symposium on
  • Conference_Location
    Long Beach, CA, USA
  • ISSN
    2158-110X
  • Print_ISBN
    978-1-4577-0812-1
  • Type

    conf

  • DOI
    10.1109/ISEMC.2011.6038334
  • Filename
    6038334
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1600694