Title :
Power noise suppression using Embedded Capacitance Material and Electromagnetic BandGap
Author :
Yu Xuequan ; Chen Qilin ; Cao Haiping
Author_Institution :
Huawei Technol. Co., Ltd., Shanghai, China
Abstract :
Power noise suppression on a mixed signal board is investigated in this paper with focus on Embedded Capacitance Material (ECM) and mushroom-type Electromagnetic Bandgap (EBG). ECM and mushroom-type EBG´s working mechanisms and their advantages and disadvantages on high speed power noise suppression are compared though simulation and confirmed on an experimental board. The combined performance of the two techniques is also studied.
Keywords :
interference suppression; optical materials; photonic band gap; embedded capacitance material; mixed signal board; mushroom-type electromagnetic bandgap; power noise suppression; Capacitors; Electronic countermeasures; Inductance; Metamaterials; Noise; Periodic structures;
Conference_Titel :
Electromagnetic Compatibility (EMC), 2011 IEEE International Symposium on
Conference_Location :
Long Beach, CA, USA
Print_ISBN :
978-1-4577-0812-1
DOI :
10.1109/ISEMC.2011.6038334
