• DocumentCode
    160081
  • Title

    Electrode compositions for laser patterned conductometric sensors

  • Author

    Holhjem, Lars ; Strand-Amundsen, Runar ; Aasmundtveit, Knut E. ; Tonnessen, Tor I.

  • Author_Institution
    Buskerud & Vestfold Univ. Coll., Borre, Norway
  • fYear
    2014
  • fDate
    16-18 Sept. 2014
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    An electrode created with maskless metallization of Cu tracks ablated with laser direct structuring on a liquid crystal polymer can never achieve a quality comparable to sputtered layers on silicon, but has the advantage of being molded into complex 3D structures. As these electrodes on molded interconnected devices can function as conductometric sensors capable of detecting ion changes in a liquid it is of high interest to characterize a variety of metal systems in terms of electrode performance. The sensor models Cu|Ni-P|Pd|Au, Cu|Ni-P|Au, Cu|Pd|Au, Cu|Pd and Cu|Ag were tested for stability in an aqueous environment, and for sensitivity to detect a change in the conductance of a liquid environment. For both tests, the Cu|Pd|Au electrode had the most stable impedance and sensitivity, with the smallest variance (10 samples of each electrode composition pair tested). Inspection by Scanning Electron Microscope with Energy Dispersive X-ray spectroscopy explained this result.
  • Keywords
    circuit stability; copper; electrodes; liquid crystal polymers; metallisation; sensitivity analysis; sensors; sputtered coatings; Cu; Cu-Ag; Cu-Ni-P-Au; Cu-Pd; Cu-Pd-Au; aqueous environment; complex 3D structure; electrode composition; electrode sensitivity; energy dispersive X-ray spectroscopy; ion change detection; laser direct structuring; laser patterned conductometric sensor; liquid crystal polymer; liquid environment conductance; maskless metallization; metal system; molded interconnected device; scanning electron microscope; silicon; sputtered layer; stability testing; Electrodes; Gold; Liquids; Nickel; Sensitivity; Sensors; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics System-Integration Technology Conference (ESTC), 2014
  • Conference_Location
    Helsinki
  • Type

    conf

  • DOI
    10.1109/ESTC.2014.6962782
  • Filename
    6962782