Compression molding solutions for wafer level, large panel substrate, and advanced packaging

There has been great progress in Compression Molding Technology and Equipment. This technology has a wide range of applications. It is used not only for the most advanced semiconductor packages, for wafer level molding, for large substrate molding, for LED´s, but also for regular MAP packages with BGA type substrates and QFN´s on leadframes to reduce cost and achieve better quality and reliability. The systems have been fully developed and are being sold for mass production. Compression Molding is the next Defacto standard.