Cu pillar FC ecosystem — Technologies for the masses

This paper describes a new generation of Flip Chip Cu Pillar CSP high volume manufacturing technology based upon innovation across the packaging industry ecosystem. This low cost small format FC CSP technology is developed for the high volume mobility and consumer product applications complementing the established FC Cu Pillar BGA technology designed for cost performance processor applications. We shall describe the establishment of an effective FC Cu Pillar ecosystem, where innovation in design, material, and process engineering, and high volume manufacturing technology comes together in congruence, bringing this advanced packaging technology to masses within the consumer product world.