• DocumentCode
    1600859
  • Title

    Analytical expressions for maximum transferred power in wireless power transfer systems

  • Author

    Sunkyu Kong ; Myunghoi Kim ; Kyoungchoul Koo ; Seungyoung Ahn ; Bumhee Bae ; Joungho Kim

  • Author_Institution
    Terahertz Interconnection & Package Lab., Korea Adv. Inst. of Sci. & Technol. (KAIST), Daejeon, South Korea
  • fYear
    2011
  • Firstpage
    379
  • Lastpage
    383
  • Abstract
    In this paper, we present the analytical expressions of the resonant peaks of input impedance and the frequencies of maximum transferred power in the wireless power transfer systems in case of tight magnetic coupling. The analytical expressions predict the frequencies of power source where the maximum power is transferred in both cases of the constant AC voltage source and the constant AC current source. We prove that the resonant frequencies of the input impedance in the wireless power transfer systems coincide with the frequencies at which the transferred power is maximized for the constant AC voltage source and the constant AC current source. The test vehicles of the coupled rectangular coils are simulated with 3D EM solver and fabricated on printed circuit boards. Experimentally, it is verified that the analytical expressions predict the changes in the resonant peaks of input impedance of the wireless power transfer systems, its relationship with frequencies of maximum transferred power and their dependency with the source type in the wireless power transfer systems.
  • Keywords
    coils; inductive power transmission; printed circuits; 3D EM solver; constant AC current source; constant AC voltage source; coupled rectangular coils; maximum transferred power; power source; printed circuit boards; tight magnetic coupling; wireless power transfer systems; Coils; Couplings; Impedance; Magnetic resonance; Three dimensional displays; Wireless communication;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility (EMC), 2011 IEEE International Symposium on
  • Conference_Location
    Long Beach, CA, USA
  • ISSN
    2158-110X
  • Print_ISBN
    978-1-4577-0812-1
  • Type

    conf

  • DOI
    10.1109/ISEMC.2011.6038340
  • Filename
    6038340