Title :
Nickel characterization for interconnect analysis
Author :
Shlepnev, Y. ; McMorrow, S.
Author_Institution :
Simberian Inc., Las Vegas, NV, USA
Abstract :
Landau-Lifshits model of ferromagnetic metal permeability is proposed in the paper for broad-band characterization of nickel in PCB/packaging interconnects made of copper plated with nickel and gold (ENIG finish). Unknown parameters of the plated nickel are identified with the measured generalized modal S-parameters of nickel-plated microstrip line segment and electromagnetic analysis of the same segment with multi-layered conductor interior model. The model predicts dispersive frequency dependency of nickel permeability with a resonance between 2 and 3 GHz. The resonance produces an anomaly in the insertion loss and group delay consistent with the experimental data.
Keywords :
S-parameters; copper; electroless deposited coatings; ferromagnetic materials; gold; integrated circuit interconnections; microstrip lines; nickel; permeability; printed circuits; Landau-Lifshits model; PCB; electromagnetic analysis; ferromagnetic metal permeability; frequency 2 GHz to 3 GHz; generalized modal S-parameters; group delay; insertion loss; interconnect analysis; microstrip line segment; multilayered conductor interior model; packaging interconnects; printed circuit boards; Computational modeling; Insertion loss; Microstrip; Nickel; Permeability; Resonant frequency; Scattering parameters;
Conference_Titel :
Electromagnetic Compatibility (EMC), 2011 IEEE International Symposium on
Conference_Location :
Long Beach, CA, USA
Print_ISBN :
978-1-4577-0812-1
DOI :
10.1109/ISEMC.2011.6038368
