• DocumentCode
    160161
  • Title

    Integrated printed hybrid electronics on paper

  • Author

    Sandberg, Henrik G. O. ; Gaspar, Cristina ; Hakola, Liisa ; Rentrop, Corne

  • Author_Institution
    VTT Tech. Res. Centre of Finland, Espoo, Finland
  • fYear
    2014
  • fDate
    16-18 Sept. 2014
  • Firstpage
    1
  • Lastpage
    3
  • Abstract
    Printed electronics is seen as an ultralow cost alternative to current mass produced electronic modules for achieving a simple function or effect. In reality only very basic electronic functions can be realized using purely additive printing and coating techniques. Even for the most simple functional electronic circuit hybrid manufacturing methods need to be employed using elements from standard SMD components as well as traditional converting technologies. In order to achieve the low cost target each processing step must be evaluated in order to reach a balance between functionality and processing as well as material cost. Reel to reel production is commonly regarded as the most cost efficient method to manufacture very high volumes of devices, and high volume is a prerequisite for low cost. We demonstrate in the ROPAS project (EC FP7 grant agreement no 263078) the manufacturing process employed to produce an electronic anti-tampering indicator based on paper as a substrate for ultra-low cost in large volumes.
  • Keywords
    coating techniques; modules; paper technology; printed circuits; surface mount technology; ROPAS project; SMD component; additive printing; basic electronic function; coating technique; electronic antitampering indicator; electronic module; functional electronic circuit hybrid manufacturing method; integrated printed hybrid electronics; material cost; paper; reel to reel production; traditional converting technology; Batteries; Ink; Light emitting diodes; Printing; Resistors; Security; Substrates;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics System-Integration Technology Conference (ESTC), 2014
  • Conference_Location
    Helsinki
  • Type

    conf

  • DOI
    10.1109/ESTC.2014.6962822
  • Filename
    6962822