DocumentCode
160161
Title
Integrated printed hybrid electronics on paper
Author
Sandberg, Henrik G. O. ; Gaspar, Cristina ; Hakola, Liisa ; Rentrop, Corne
Author_Institution
VTT Tech. Res. Centre of Finland, Espoo, Finland
fYear
2014
fDate
16-18 Sept. 2014
Firstpage
1
Lastpage
3
Abstract
Printed electronics is seen as an ultralow cost alternative to current mass produced electronic modules for achieving a simple function or effect. In reality only very basic electronic functions can be realized using purely additive printing and coating techniques. Even for the most simple functional electronic circuit hybrid manufacturing methods need to be employed using elements from standard SMD components as well as traditional converting technologies. In order to achieve the low cost target each processing step must be evaluated in order to reach a balance between functionality and processing as well as material cost. Reel to reel production is commonly regarded as the most cost efficient method to manufacture very high volumes of devices, and high volume is a prerequisite for low cost. We demonstrate in the ROPAS project (EC FP7 grant agreement no 263078) the manufacturing process employed to produce an electronic anti-tampering indicator based on paper as a substrate for ultra-low cost in large volumes.
Keywords
coating techniques; modules; paper technology; printed circuits; surface mount technology; ROPAS project; SMD component; additive printing; basic electronic function; coating technique; electronic antitampering indicator; electronic module; functional electronic circuit hybrid manufacturing method; integrated printed hybrid electronics; material cost; paper; reel to reel production; traditional converting technology; Batteries; Ink; Light emitting diodes; Printing; Resistors; Security; Substrates;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics System-Integration Technology Conference (ESTC), 2014
Conference_Location
Helsinki
Type
conf
DOI
10.1109/ESTC.2014.6962822
Filename
6962822
Link To Document