DocumentCode :
1601633
Title :
Effect of Elastic Modulus on the Stress in Single Lap Joints with a Metal Mosaic Block
Author :
You, Min ; Zhu, Dingfeng ; Zheng, Xiaoling ; Yan, Jialing ; Xiong, Nanfeng ; Luo, Wei
Author_Institution :
Hubei Key Lab. of Hydroelectric Machinery Design & Maintenance, China Three Gorges Univ., Yichang, China
Volume :
4
fYear :
2010
Firstpage :
266
Lastpage :
269
Abstract :
The effect of the elastic modulus of the adhesives on the stress distribution in single lap joint with a steel mosaic block under loading was investigated using the elastic-plastic finite element method (FEM). The results show that the stress in the adhesive layer increases as the elastic modulus of adhesive increased while the stress in the mosaic block (along the elongation line of the mid-bondline) decreased. The effect of the mosaic block to enhance the joint was weakened when the adhesive with high elastic modulus was used. When the adhesives with lower elastic modulus used, the ability of deformation for the adhesive layer may increase. And the peak stresses near the free end of the lap zone would be reduced so that the shear stress in the mosaic block was increased and the mosaic block carried more load. It is suggested that a suitable elastic modulus of adhesives be chosen when it is demanded to improve the load bearing capacity of the adhesively bonded joint.
Keywords :
adhesive bonding; adhesives; couplings; elastic deformation; elastic moduli; elastoplasticity; finite element analysis; steel; stress analysis; adhesive bonded joint; deformation ability; elastic modulus; elastic plastic finite element method; load bearing capacity; metal mosaic block; shear stress; single lap joints; stress distribution; Bonding; Building materials; Chemical elements; Finite element methods; ISO standards; Joining materials; Steel; Stress; Surface fitting; Welding; FEA; adhesives; elastic modulus; steel mosaic block; stress distribution;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Computer Modeling and Simulation, 2010. ICCMS '10. Second International Conference on
Conference_Location :
Sanya, Hainan
Print_ISBN :
978-1-4244-5642-0
Electronic_ISBN :
978-1-4244-5643-7
Type :
conf
DOI :
10.1109/ICCMS.2010.255
Filename :
5421461
Link To Document :
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