DocumentCode
1601634
Title
Modelling electromagnetic field coupling from an ESD gun to an IC
Author
Ji Zhang ; Beetner, D.G. ; Moseley, R. ; Herrin, S. ; Pommerenke, D.
Author_Institution
EMC Lab., Missouri Univ. of Sci. & Technol., Rolla, MO, USA
fYear
2011
Firstpage
553
Lastpage
558
Abstract
IC designers require fast and accurate methods of simulating immunity of ICs to ESD events to adequately predict and analyze ESD issues. The common method of predicting electromagnetic field coupling from an ESD gun to an IC, however, requires substantial simulation time and does not typically account for the full IC layout. Here we propose an efficient methodology for calculating the electromagnetic field coupling from an ESD gun to an IC while fully considering the non-linear circuit elements in the IC core. Voltages and currents within the IC are found by merging full-wave simulations of an ESD gun with a SPICE model of the IC and the coupled electromagnetic energy. The capability of the proposed method was verified through experiments on a pseudo- integrated circuit structure. Results show the promise of the method. This hybrid modelling method can significantly accelerate simulation time compared with traditional full-wave modelling techniques and can allow the designer to better explore the variation in coupling that occurs with small changes in the test setup, such as the position and orientation of the gun and IC.
Keywords
electromagnetic fields; electrostatic discharge; immunity testing; integrated circuit layout; ESD events; ESD gun; ESD issues; IC core; IC designers; SPICE model; coupled electromagnetic energy; electromagnetic field coupling; full IC layout; full-wave modelling techniques; full-wave simulations; hybrid modelling method; immunity simulation; nonlinear circuit elements; pseudo-integrated circuit structure; simulation time; Couplings; Electrostatic discharge; Integrated circuit modeling; Pins; Predictive models; Voltage measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Electromagnetic Compatibility (EMC), 2011 IEEE International Symposium on
Conference_Location
Long Beach, CA, USA
ISSN
2158-110X
Print_ISBN
978-1-4577-0812-1
Type
conf
DOI
10.1109/ISEMC.2011.6038373
Filename
6038373
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