• DocumentCode
    1601634
  • Title

    Modelling electromagnetic field coupling from an ESD gun to an IC

  • Author

    Ji Zhang ; Beetner, D.G. ; Moseley, R. ; Herrin, S. ; Pommerenke, D.

  • Author_Institution
    EMC Lab., Missouri Univ. of Sci. & Technol., Rolla, MO, USA
  • fYear
    2011
  • Firstpage
    553
  • Lastpage
    558
  • Abstract
    IC designers require fast and accurate methods of simulating immunity of ICs to ESD events to adequately predict and analyze ESD issues. The common method of predicting electromagnetic field coupling from an ESD gun to an IC, however, requires substantial simulation time and does not typically account for the full IC layout. Here we propose an efficient methodology for calculating the electromagnetic field coupling from an ESD gun to an IC while fully considering the non-linear circuit elements in the IC core. Voltages and currents within the IC are found by merging full-wave simulations of an ESD gun with a SPICE model of the IC and the coupled electromagnetic energy. The capability of the proposed method was verified through experiments on a pseudo- integrated circuit structure. Results show the promise of the method. This hybrid modelling method can significantly accelerate simulation time compared with traditional full-wave modelling techniques and can allow the designer to better explore the variation in coupling that occurs with small changes in the test setup, such as the position and orientation of the gun and IC.
  • Keywords
    electromagnetic fields; electrostatic discharge; immunity testing; integrated circuit layout; ESD events; ESD gun; ESD issues; IC core; IC designers; SPICE model; coupled electromagnetic energy; electromagnetic field coupling; full IC layout; full-wave modelling techniques; full-wave simulations; hybrid modelling method; immunity simulation; nonlinear circuit elements; pseudo-integrated circuit structure; simulation time; Couplings; Electrostatic discharge; Integrated circuit modeling; Pins; Predictive models; Voltage measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility (EMC), 2011 IEEE International Symposium on
  • Conference_Location
    Long Beach, CA, USA
  • ISSN
    2158-110X
  • Print_ISBN
    978-1-4577-0812-1
  • Type

    conf

  • DOI
    10.1109/ISEMC.2011.6038373
  • Filename
    6038373