Fracture mechanics analysis of cracks in multilayer ceramic capacitors

Author

Al Ahmar, Joseph ; Wiese, Stefan

Author_Institution

Saarland Univ., Saarbrucken, Germany

fYear

2014

fDate

16-18 Sept. 2014

Firstpage

1

Lastpage

5

Abstract

Finite element modelling of multilayer ceramic capacitors (MLCCs) is presented. The stress distribution due to thermo-mechanical loads is estimated. Thermal cool down after soldering process is considered and afterwards a three point bending test has been done. Once the critical stress regions on ceramic are estimated, a fracture mechanics analysis has been performed. Cracks are initiated and fracture parameters were estimated using a direct approach, based on the crack opening displacement and also an energy approach by calculating the J-integral parameter. Finally the fracture mechanics parameters are used for investigating the crack bifurcation.

Keywords

bending; bifurcation; ceramic capacitors; cracks; finite element analysis; fracture mechanics; soldering; stress analysis; J-integral parameter; MLCC; crack bifurcation; crack opening displacement; critical stress region; finite element modelling; fracture mechanics analysis; multilayer ceramic capacitor; soldering process; stress distribution; thermal cool down; thermomechanical load; three point bending test; Assembly; Capacitors; Ceramics; Finite element analysis; Stress; Temperature;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics System-Integration Technology Conference (ESTC), 2014

Conference_Location

Helsinki

Type

conf

DOI

10.1109/ESTC.2014.6962828

Filename

6962828