Accelerated life tests of lead free solder alloys in presence of distilled water

Author

Nogueira, Enrique ; Fernandez, Alicia ; Florez, A. ; Santos, R.A. ; Mino, E.

Author_Institution

Dept. Electron. Fis., Univ. Politec. Madrid UPM, Madrid, Spain

fYear

2013

Firstpage

249

Lastpage

252

Abstract

The Restriction of Hazardous Substances (RoHS) in electronic equipment imposed by legal considerations does not allow the manufacture of electronic equipments with alloys containing lead. As an ecological alternative, it can be used lead free alloys. Electrochemical migration is a reliability problem in printer circuit boards in high humidity environments. In this paper, the electrochemical migration of one solder that contains lead (Sn36Pb2Ag) and two lead free solder alloys (5n3.5Ag and Sn3.8Ag0.7Cu) were analyzed under presence of distilled water. It was analyzed the failure distribution times of three different types of solder pastes, with three voltages, and three strip spacing. Lead free solder pastes are more reliable than paste that contains lead. Exponential- Weibull model was the more adequate for the test results.

Keywords

RoHS compliance; Weibull distribution; copper alloys; ecology; electromigration; electronic equipment manufacture; exponential distribution; lead; lead alloys; life testing; reliability; silver alloys; solders; tin alloys; RoHS; SnAgCu; SnPbAg; accelerated life tests; distilled water; ecological alternative; electrochemical migration; electronic equipments manufacture; exponential-Weibull model; failure distribution times; humidity environments; lead free alloys; lead free solder alloys; lead free solder pastes; legal considerations; printer circuit boards; reliability problem; restriction of hazardous substances; strip spacing; Electrodes; Environmentally friendly manufacturing techniques; Materials; Mathematical model; Strips; Tin; Reliability; accelerated testing; environmental testing; migration;

fLanguage

English

Publisher

ieee

Conference_Titel

Electron Devices (CDE), 2013 Spanish Conference on

Conference_Location

Valladolid

Print_ISBN

978-1-4673-4666-5

Electronic_ISBN

978-1-4673-4667-2

Type

conf

DOI

10.1109/CDE.2013.6481389

Filename

6481389