Title : 
Current distribution between an X-pinch and a current-return rod or parallel X-pinches
         
        
            Author : 
Shen Zhao ; Xinlei Zhu ; Xiaobing Zou ; Xinxin Wang
         
        
            Author_Institution : 
Dept. of Electr. Eng., Tsinghua Univ., Beijing, China
         
        
        
        
        
            Abstract : 
Summary form only given. Current distribution between X-pinches and copper current-return rods was studied, considering the effect of mutual influence between different branches. In the experiment of current distribution between an X-pinch and a copper current-return rod, the current in the X-pinch is roughly the same with that in the current-return rod until the X-ray burst, which reflects that the current in the copper rod flows on its surface, and that the current in the X-pinch flows on the plasma rather than the wires, resulting in a same impedance of significantly different wires. For the same kind of wire, the bigger the diameter, the longer the plasma lasts, and the longer the current in the X-pinch equals to that in the current-return rod. In the experiment of current distribution between two Xpinches, the current flowing through the two X-pinches does not depend on the diameter or material of the X-pinch, confirming that X-pinches of different materials and diameters have the same impedance. The amplitude of current flowing in the X-pinch farther from the polyformaldehyde isolation rod is always slightly higher than the other, indicating the influence of the mutual inductance between the branch circuits.
         
        
            Keywords : 
copper; electric current; electric impedance; inductance; pinch effect; plasma transport processes; polymers; Cu; X-ray burst; branch circuit; current distribution; current-return rod flow; electric impedance; mutual inductance; parallel X-pinch flow; plasma; polyformaldehyde isolation rod; wire; Copper; Current distribution; Electrical engineering; Impedance; Materials; Plasmas; Wires;
         
        
        
        
            Conference_Titel : 
Plasma Science (ICOPS), 2013 Abstracts IEEE International Conference on
         
        
            Conference_Location : 
San Francisco, CA
         
        
        
        
            DOI : 
10.1109/PLASMA.2013.6635209