DocumentCode :
160195
Title :
ATLAS™ based simulation study of the electrical characteristics of dual-metal-gate (DMG) fully-depleted (FD) recessed-source/drain (Re-S/D) SOI MOSFETs
Author :
Saramekala, Gopi Krishna ; Jit, S. ; Tiwari, P.K.
Author_Institution :
Dept. of Electron. & Commun. Eng., Nat. Inst. of Technol., Rourkela, India
fYear :
2014
fDate :
9-11 Jan. 2014
Firstpage :
1
Lastpage :
4
Abstract :
Recessed-Source/Drain (Re-S/D) SOI (Silicon on Insulator) MOSFETs (Metal-Oxide-Semiconductor Field-Effect-Transistors) offer higher drain current compare to conventional SOI MOSFETs which may be attributed to large source and drain area in recessed S/D devices. The concept of dual-metal-gate has already been incorporated in the recessed S/D SOI MOSFETs by our group and the devices have been named as Re-S/D fully-depleted (FD) SOI MOSFETs. In this work, 2D numerical simulations have been carried out to study the electrical characteristics like surface potential, threshold voltage and drain current of Re-S/D FD SOI MOSFETs. Device parameters like the depth of S/D in the buried oxide and gate length ratio are varied to access their impact on the surface potential, threshold voltage and drain current. All these numerical simulation results are obtained from ATLAS™, a 2-D numerical device simulator from SILVACO Inc.
Keywords :
MOSFET; numerical analysis; silicon-on-insulator; 2D numerical device simulator; ATLAS based simulation study; DMG FD re-S/D SOI MOSFETs; buried oxide; device parameters; drain current; dual-metal-gate fully-depleted recessed-source-drain SOI MOSFETs; electrical characteristics; gate length ratio; metal-oxide-semiconductor field-effect-transistors; silicon on insulator; surface potential; threshold voltage; Electric potential; Logic gates; MOSFET; Metals; Numerical models; Silicon-on-insulator; Threshold voltage; DMG FD SOI MOSFETs; Short Channel Effects; recessed-source/drain (Re-S/D);
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Advances in Electrical Engineering (ICAEE), 2014 International Conference on
Conference_Location :
Vellore
Type :
conf
DOI :
10.1109/ICAEE.2014.6838458
Filename :
6838458
Link To Document :
بازگشت